Seminar Information
Title: Beyond-CMOS Integrated Circuits: Interconnect, Communications, Clocking and Nano/Spintronics
Time: 14:00-15:30, September 18, 2013（Wednesday）
Location: Room 401, School of Microelectronics
Speaker: Dr. Hui Wu (University of Rochester, USA)
Abstract:
We are witnessing a paradigm change in integrated circuits as CMOS technologies approaching the end of the roadmap, thanks to the relentless Moore’s Law scaling in the last forty years. Computing is increasingly limited by the power wall, memory wall, and interconnect bottleneck in microprocessors, as evident in the recent shift from GHz race to many-core parallelism. Our research is seeking to address these fundamental challenges on the device, circuit, and system levels using novel design techniques and beyond-CMOS technologies. In this talk, I will try to showcase our research in several areas: 1) high-speed on-chip and inter-chip interconnects, including 3-D Integrated Intra-Chip Free-Space Optical Interconnect, and a new electrical interconnect system based on pulse communications using on-chip transmission lines. 2) high-speed transceivers based on distributed circuit techniques, including a new arbitrary waveform generator and an analog correlator, both operating at 10-GSample/s. 3) high-performance clocking using injection-locked oscillators, which has demonstrated significant performance advantages compared to conventional clocking. 4) Integrated circuits using emerging nanoelectronic and spintronic devices, including THz amplifiers using ballistic transistors and reconfigurable magneto logic gates (MLG).
Biography:
Hui Wu received the B.Sc. degree in electrical engineering and M.Sc. degree in microelectronics from TsinghuaUniversity in 1996 and 1998, and the Ph.D. degree in electrical engineering from California Institute of Technology in 2003, respectively. He was a co-op researcher at IBM T. J. Watson Research Center in 2001, and a senior engineer at Axiom Microdevices in 2002-2003.
In 2003, Dr. Wu joined the faculty of the University of Rochester, where he is an Associate Professor of Electrical and Computer Engineering and director of Laboratory for Advanced Integrated Circuits and Systems. His current research interests are in inter-and intra-chip optical/electrical interconnects, wideband RF and high-speed integrated circuits, high performance clocking, wireless sensors, silicon photonics, electronic-photonic integrated circuits (EPIC), and nanoelectronics using emerging technologies. Dr. Wu has authored and co-authored over sixty peer-reviewed papers in leading technical journals and conferences, and holds several U.S. patents. He serves in the Technical Program Committee of IEEE Compound Semiconductor IC Symposium and review panels of JSSC, MTT, PTL and other journals. Dr. Wu was the recipient of IBM Fellowship (2002) and winner of the Best Paper Award in SiRF conference (2008).
