陈海宝

        现为上海交通大学电子信息与电气工程学院微纳电子学系副教授、博士生导师，长期从事集成电路设计自动化、人工智能算法与应用及其硬件实现等领域的研究。2006年6月、2008年6月、2012年3月分别在西安交通大学获得学士、硕士和博士学位。2012-2013年，担任华为技术有限公司西安研究所IT产品线技术开发部研究工程师，从事大数据相关预研和开发工作；2013-2014年，在美国加州大学河滨分校电子工程系从事博士后研究工作；2014年10月加入上海交通大学电子信息与电气工程学院担任讲师；2017年12月至今担任上海交通大学电子信息与电气工程学院副教授。指导50余名硕士和博士研究生，已毕业36人（博士3人）。在IEEE TCAD、IEEE TCSVT、IEEE TDMR、IEEE TED、IEEE TAC、IEEE TVLSI、IEEE TCAS II、IEEE GRSL、ACM TODAES、ACM TECS、ACM TIST、ACMTIOT、ACM TOMM等国际期刊以及AAAI、DAC、ICCAD、DATE、ASP-DAC、CDC等国际会议上发表学术论文90余篇，其中IEEE和ACM 顶级期刊和会议论文约50篇（IEEE和ACM Transactions期刊论文26篇），Google学术引用1100余次。主持或参加多项国家自然科学基金、国家重大研发计划、企事业单位合作项目，累计科研经费1000余万元。2015年在EDA领域国际学术会议ASP-DAC上获得最佳论文提名奖，2017年指导研究生获得IEEE ASIC优秀论文奖，2018年指导研究生获得IEEE ICSICT优秀论文奖，2019年获得中国人工智能学会吴文俊人工智能技术发明三等奖，2020年获上海交通大学教书育人奖提名奖，2020年指导研究生获集成电路EDA设计精英赛挑战赛总决赛二等奖，2021年指导本科生获全国集成电路创新创业大赛全国总决赛一等奖，2022年获上海交通大学优秀班主任荣誉称号，2022-2023年担任EDA技术白皮书工具方向主编，2023年指导本科生获全国集成电路创新创业大赛全国总决赛二等奖及华东赛区一等奖，2023年获上海交通大学“十佳班主任”荣誉称号（全校10人）。自2016年起担任集成电路设计自动化领域期刊Integration-the VLSI Journal副编辑。

        实验室长期招聘具有集成电路科学与工程、计算机科学与技术、电子科学与技术、软件工程、自动控制、应用数学等相关专业背景的优秀硕士生、博士生和博士后。
 

Hai-Bao Chen received the B.S. degree in information and computing sciences, and the M.S. and Ph.D. degrees in applied mathematics from Xian Jiaotong University, Xian, China, in 2006, 2008, and 2012, respectively. He then joined Huawei Technologies, where he focused on cloud computing and big data. He was a Post-Doctoral Research Fellow with Electrical Engineering Department, University of California, Riverside, CA, USA, from 2013 to 2014. He is currently an Associate Professor in the Department of Micro/Nano-electronics, Shanghai Jiao Tong University, Shanghai, China. His current research interests include electromigration reliability, circuit simulation, model order reduction, system and control theory, and artificial intelligence. Dr. Chen has authored or co-authored about 90 papers in scientific journals and conference proceedings. He received one Best Paper Award nomination from Asia and South Pacific Design Automation Conference (ASP-DAC) in 2015. Since 2016，Dr. Chen serves a s an Associate Editor for Integration-the VLSI Journal.

研究方向：

1、集成电路设计自动化

2、人工智能算法及应用

 
代表性论文(*Corresponding Author)

1. Hai-Bao Chen^*, Xinjie Zhang, Wenjie Zhu, Jie Chen, Pengpeng Ren, Zhigang Ji, Junhua Liu, Runsheng Wang, and Ru Huang, “DRGA-based second-order block Arnoldi method for model order reduction of MIMO RCS circuits”, to appear in IEEE Transactions on Circuits and Systems I: Regular Papers, pp. 1-14, 2024.

2. Tianshu Hou, Ngai Wong, Quan Chen, Zhigang Ji, Hai-Bao Chen^*, “Analytical post-voiding modeling and efficient characterization of EM failure effects under time-dependent current stressing,”IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 42, no. 12, pp. 4959-4972, 2023.

3. Peining Zhen, Xiaotao Yan, Wei Wang, Hao Wei, Hai-Bao Chen^*，“A highly compressed accelerator with temporal optical flow feature fusion and tensorized LSTM for video action recognition on terminal device,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 42, no. 10, pp. 3129-3142, 2023.

4. Tianshu Hou, Peining Zhen, Ngai Wong, Quan Chen, Guoyong Shi, Shuqi Wang, Hai-Bao Chen^*, “Multilayer perceptron based stress evolution analysis under DC current stressing for multi-segment wires,”IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 42, no. 2, pp. 544-557, 2023.

5. Tianshu Hou, Ngai Wong, Quan Chen, Zhigang Ji and Hai-Bao Chen^*, “A space-time neural network for analysis of stress evolution under DC current stressing,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 41, no. 12, pp. 5501-5514, 2022.

6. Peining Zhen, Xiaotao Yan, Wei Wang, Tianshu Hou, Hao Wei, Hai-Bao Chen^*, “Towards compact transformers for end-to-end object detection with decomposed chain tensor structure,” IEEE Transactions on Circuits and Systems for Video Technology (TCSVT), vol. 33, no. 2, pp. 872-885, 2023.

7. Tianshu Hou,Peining Zhen, Zhigang Ji, Hai-Bao Chen^*,“A deep learning framework for solving stress-based partial differential equations in electromigration analysis,” ACM Transactions on Design Automation of Electronic Systems (TODAES),vol.4,no.57, pp.1-20,2023.

8. Hazem Mohammed, Hai-Bao Chen, Yongfu Li, Nabil Sabor, Ji-Guang Wang and Guoxing Wang, “Meta-Analysis of Pulse Transition Features in Non-Invasive Blood Pressure Estimation Systems: Bridging Physiology and Engineering Perspectives, ”IEEE Transactions on Biomedical Circuits and Systems, vol. 17, no. 6, pp. 1257-1281, 2023.

9. Dinghao Chen, Wenjie Zhu, Xiaoman Yang, Pengpeng Ren, Zhigang Ji, Hai-Bao Chen^*, “Physics-Informed Learning for EPG-Based TDDB Assessment,”to appear inAsia South Pacific Design Automation Conference (ASP-DAC), pp.1-6, 2023.

10. Tianshu Hou, Yuan Ren, Wenyong Zhou, Can Li, Zhongrui Wang, Hai-Bao Chen, Ngai Wong,“Physics-Informed Learning for Versatile RRAM Reset and Retention Simulation,”to appear inAsia South Pacific Design Automation Conference (ASP-DAC), pp.1-6, 2023.

11. Peining Zhen, Shuqi Wang, Suming Zhang, Xiaotao Yan, Wei Wang, Zhigang Ji, and Hai-Bao Chen^*, “Towards accurate oriented object detection in aerial images with adaptive multi-level feature fusion,” ACM Transactions on Multimedia Computing, Communication, and Applications (TOMM), vol. 19, no. 1, pp. 1-22, 2023.

12. Xiang Liu , Pengpeng Ren , Hai-Bao Chen, Zhigang Ji , Junhua Liu , Runsheng Wang , Jianfu Zhang , Ru Huang，“Equiprobability-based local response surface method for high-sigma yield estimation with high accuracy and efficiency,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 42, no. 4, pp. 1346-1350, 2023.

13. Peining Zhen, Ziyang Gao, Tianshu Hou, Yuan Cheng, and Hai-Bao Chen^*, “Deeply tensor compressed transformer for end-to-end detection,” AAAI Conference on Artificial Intelligence, pp. 1-9, 2022.

14. Yuan Cheng, Rui Lin, Peining Zhen, Tianshu Hou, Chiu Wa Ng, Hai-Bao Chen^*, Hao Yu, and Ngai Wong, “Fassst: Fast attentionbased single-stage segmentation net for real-time instance segmentation,” in Proceedings of the IEEE/CVFWinter Conference on Applications of Computer Vision (WACV), pp. 2210–2218, 2022.

15. Yiwei Fang, Guan Wang, Peining Zhen, Xiaoyu Wang, and Hai-Bao Chen^*, “Automatic Monitoring System for Engines Motion Attitude Based on Video Image Detection,”International Computer Software and Applications Conference (COMPSAC), pp. 1-7, 2022.

16. Xinjie Zhang, Hai-Bao Chen^*, Jie Chen, “RGA-SOBAR: Second-order block Arnoldi method based on relative gain array for model order reduction of MIMO RCS circuits,” IEEE Conference on Decision and Control (CDC), pp. 6908-6913, 2021.

17. Yuan Cheng, Yuchao Yang, Hai-Bao Chen^*, Ngai Wong, Hao Yu, “S3-Net: A fast scene understanding network by single-shot segmentation for autonomous driving,” ACM Transactions on Intelligent Systems and Technology, vol. 12, no. 5, Article 58, pp. 5801-5819, September 2021.

18. Yuan Cheng, Yuchao Yang, Hai-Bao Chen, Ngai Wong, Hao Yu, “S3-Net: A Fast and Lightweight Video Scene Understanding Network by Single-shot Segmentation,” in Proceedings of the IEEE/CVFWinter Conference on Applications of Computer Vision (WACV), 3328-3336, 2021.

19. Peining Zhen, Hai-Bao Chen^*, Yuan Cheng, Zhigang Ji, Bin Liu, Hao Yu, “Fast video facial expression recognition by a deeply tensor-compressed LSTM neural network for mobile devices,” ACM Transactions on Internet of Things, vol. 2, no. 4, Article 2, pp. 2301-2326, July 2021.

20. Zhuojun Liang, Dongxu Lv,Chao Cui,Hai-Bao Chen, Weifeng He, Weiguang Sheng, Naifeng Jing, Zhigang Mao, Guanghui He, “A 3.85-Gb/s 8×8 soft-output MIMO detector with lattice-reduction-aided channel preprocessing, ”IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 29, no. 2, 307-320, 2021.

21. Hai-Bao Chen, Shan Jiang, Guanghui He, Bingyi Zhang, and Hao Yu, “TEANS: A target enhancement and attenuated non-maximum suppression object detector for remote sensing images,”IEEE Geoscience and Remote Sensing Letters (GRSL), vol. 18, no. 4, pp. 632-636, 2021.

22. Yide Du, Linglin Jing, Hui Fang, Hai-Bao Chen, Yimao Cai, Runsheng Wang, Jianfu Zhang , and Zhigang Ji, “Exploring the impact of random telegraph noise-induced accuracy loss on resistive RAM-based deep neural network,”IEEE Transactions on Electron Devices, vol. 67, no. 8, pp. 3335-3340, Aug. 2020.

23. Yuan Cheng, Guangya Li, Ngai Wong, Hai-Bao Chen^*, and Hao Yu,“DEEPEYE: A deeply tensor-compressed neural network for video comprehension on terminal devices”, ACM Transactions on Embedded Computing Systems, 19, no. 3, pp. 1801-1825, 2020.

24. Weimeng Liang, Hai-Bao Chen^*, Guanghui He, and Jie Chen, “Model order reduction based on dynamic relative gain array for MIMO systems”, IEEE Transactions on Circuits and Systems II: Express Briefs, vol. 67-II, no. 11, pp. 2507-2511, 2020.

25. Yuan Cheng, Guangtai Huang, Peining Zhen, Bin Liu, Hai-Bao Chen^*, Ngai Wong, Hao Yu, “An anomaly comprehension neural network for surveillance videos on terminal devices”, Design, Automation and Test in Europe Conference (DATE), pp. 1-6, 2020.

26. Shuo Zhang, Guanghui He, Hai-Bao Chen, Naifeng Jing, and Qin Wang, “Scale adaptive proposal network for object detection in remote sensing images,” IEEE Geoscience and Remote Sensing Letters, vol. 16, no. 6, pp. 864-868, 2019.

27. Yuan Cheng, Chao Wang, Hai-Bao Chen^*, and Hao Yu, “A large-scale in-memory computing for deep neural network with trained quantization,” Integration, 69, pp. 345-355, 2019.

28. Yuan Cheng, Guangya Li, Ngai Wong, Hai-Bao Chen, Hao Yu, “DEEPEYE: A deeply Tensor-compressed neural network hardware accelerator”, International Conference on Computer Aided Design(ICCAD), pp. 1-6, 2019.

29. Hengyang Zhao, Qi Hua, Hai-Bao Chen^*, Yaoyao Ye, Hai Wang, Sheldon X.-D. Tan, and Esteban Tlelo-Cuautle, “Thermal sensor based occupancy detection for smart buildings using machine learning methods,” ACM Transactions on DesignAutomation of Electronic Systems (TODAES), vol. 23, no. 4, pp. 5401-5421, 2018.

30. Xiaotang Tang, Sheldon X.-D. Tan, and Hai-Bao Chen, “SVM based intrusion detection using nonlinear scaling scheme,” IEEE 14th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)， 1-4, Nov. 2018. (Excellent Student Paper)

31. Shaoyi Peng, Han Zhou, Taeyoung Kim, Hai-Bao Chen, and Sheldon X. -D. Tan,“Physics-based compact TDDB models for low-k BEOL Copper interconnects with time-varying voltage stressing,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 26, no. 2, pp. 239-248,

32. Hai-Bao Chen^*，Sheldon X.-D. Tan, Jiangtao Peng, Taeyoung Kim,and Jie Chen,“Analytical modeling of electromigration failure for VLSI interconnect tree considering temperature and segment length effects,” IEEE Transactions on Device and Materials Reliability (TDMR), vol. 17, no. 4, pp. 653-666,2017.

33. Taeyoung Kim, Zeyu Sun, Hai-Bao Chen, Hai Wang, Sheldon X. -D. Tan,“Energy and lifetime optimizations for dark Silicon manycore microprocessor considering both hard and soft Errors,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 25, no. 9, pp. 2561-2574,

34. Jiangtao Peng, Hai-Bao Chen^*, Hengyang Zhao, Zeyu Sun and Sheldon X.-D. Tan, “Dynamic temperature-aware reliability modeling for multi-branch interconnect trees,” IEEE 12th International Conference on ASIC (ASICON), pp. 1-4, 2017.(Excellent Student Paper)

35. Hai-Bao Chen，Sheldon X.-D. Tan, Valeriy Sukharev, Xin Huang,and Taeyoung Kim,“Analytical modeling and characterization of electromigration effects for multi-branch interconnect trees,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 35, no. 11, pp. 1811-1824, 2016.

36. Yue Zhao, Taeyoung Kim, David H. Shin, Sheldon X.-D. Tan, Xin Li, Hai-Bao Chen, Hai Wang, “Statistical rare event analysis and parameter guidance by elite learning sample selection,” ACM Transactions on Design Automation of Electronic Systems (TODAES), vol. 21, no. 4, pp. 5601-5621, 2016.

37. Taeyoung Kim, Xin Huang, Hai-Bao Chen, Sheldon X.-D. Tan, and Valeriy Sukharev, “Learning-based dynamic reliability management for dark Silicon processor considering EM effects,”Design, Automation and Test in Europe (DATE), pp.463-468, 2016.

38. Xin Huang, Valeriy Sukharev, Taeyoung Kim, Hai-Bao Chen, and Sheldon X.-D. Tan, “Electromigration recovery modeling and analysis under time-dependent current and temperature stressing,”Asia South Pacific Design Automation Conference (ASP-DAC), pp.244-249, 2016.

39. Wandi Liu, Hai Wang, Hengyang Zhao, Shujuan Wang, Hai-Bao Chen, Yuzhuo Fu, Jian Ma, Xin Li, Sheldon X.-D. Tan, “Thermal modeling for energy-efficient smart building with advanced overfitting mitigation technique,”Asia South Pacific Design Automation Conference (ASP-DAC’16), pp.417-422, 2016.

40. Hai-Bao Chen,Ying-Chi Li , Sheldon X.-D. Tan, Xin Huang, Hai Wang, and Ngai Wong, “H-matrix-based finite-element-based thermal analysis for 3D ICs,” ACM Transactions on Design Automation of Electronic Systems (TODAES), 20, no. 4, pp. 4701-4725, 2015.

41. Hai-Bao Chen, Sheldon X.-D. Tan, Hai Wang, and Guoyong Shi, “H²-based finite element linear solver for transient thermalanalysis of high-performance ICs,” International Journal of Circuit Theory andApplications, 43, no. 12, pp. 1953-1970, 2015.

42. Chen Qiao, Hai-Bao Chen, Wenfeng Jing and Kefeng Sun, “Towards establishing a meaningful and practical dynamics results for the unified RNN model,” Neurocomputing, 157, pp. 315-322,2015.

43. Hengyang Zhao, Daniel Quach, Shujuan Wang, Hai Wang, Hai-Bao Chen, Xin Li, and Sheldon X.-D. Tan, “Learning based compact thermal modeling for energy-efficient smart building management,”IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 450-456, Nov. 2015.

44. Hai-Bao Chen，Sheldon X.-D. Tan, Valeriy Sukharev, Xin Huang,and Taeyoung Kim,“Interconnect reliability modeling and analysis for multi-branch interconnect trees,” IEEE/ACM Design Automation Conference (DAC), 1-6, June 2015.

45. Hai-Bao Chen, Sheldon Tan, Xin Huang, and Valeriy Sukharev, “New electromigrationmodeling and analysisconsidering time-varying temperature and current densities,” Asia South Pacific Design Automation Conference (ASP-DAC’15), pp.352-357, 2015. (Best Paper Award Nomination)

46. Zao Liu, Sahana Swarup, Sheldon X.-D. Tan, Hai-Bao Chenand Hai Wang, “Compact lateral thermal resistance model ofTSVs for fast finite-difference based thermal analysis of 3D stacked ICs,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 33, no. 10, pp. 1490-1502, 2014.

47. Valeriy Sukharev, Xin Huang,Hai-Bao Chen, and Sheldon Tan, “IR-drop based electromigration assessment: parametric failure chip-scale analysis,”IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 428-433, Nov. 2014.

48. Taeyoung Kim, Bowen Zheng, Hai-Bao Chen, Qi Zhu, Valeriy Sukharev, and Sheldon Tan, “Lifetime optimization for real-time embedded systems considering electromigration effects,”IEEE/ACM International Conference on Computer-Aided Design (ICCAD), pp. 434-439, Nov. 2014.

49. Yao-Lin Jiang and Hai-Bao Chen, “Time domain model order reduction of general orthogonal polynomials for linear input-outputsystems,”IEEE Transactions on Automatic Control (TAC), vol. 57, no. 2, pp. 330-343, 2012.

50. Yao-Lin Jiang and Hai-Bao Chen, “Application of general orthogonal polynomials to fast simulation of nonlinear descriptor systemsthrough piecewise-linear approximation,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), vol. 31, no. 5, pp. 804-808, 2012.

授课教学：

本科生：数字信号处理、离散数学

研究生：电子电路设计自动化、神经网络与机器学习