讲座题目：Design flow overview for GLOBALFOUNDRIES® 22FDX Technology
主讲人：
齐斌 资深芯片设计工程师
西北工业大学计算机系统结构专业研究生，先后就职于NVidia，IBM, GLOBALFOUNDRIES，拥有15年芯片设计经历，曾参与0.25um/130/190/65/45/32/28/22工艺节点的多个国内外的大型项目及后端流程开发，具有丰富的电路设计及后端物理实现经验。精通floorplan/place&route/clock/STA/chip signoff流程。
凌斌 资深芯片后端工程师
先后就职于IBM, GLOBALFOUNDRIES，东南大学硕士，从业经历将近十年，参与了多个国内外的大型项目，拥有丰富的自动布局布线经验。经历65/45/32/22/14nm工艺，参与后端新工艺流程开发，精通floorplan/timing/power/physical signoff 各个环节。
时间：5月9日 （星期三）10:00
地点：微电子大楼105教室
Abstract: Compare to traditional bulk CMOS technology, GLOBALFOUNDRIES 22FDX technology provides much better transistor characteristics both in power & performance. 22FDX technology enable customers have chance to get a performance and power balanced design by leverage FD-SOI technology and Body-Bias feature. The manufactory process is much similar to traditional 28nm bulk CMOS. These features let 22FDX fits both performance , power and cost sensitive application scenarios.
This seminar will introduce how to implement a quad-cores ARM CORTEXA53 design with 22FDX process. It will cover all stage of design flow including floorplan, Place & Route, Timing Verification, and Physical Verification.
