程萍

2000-2005年 上海交通大学获工学博士学位（硕博连读）；
2006-2008年 清华大学博士后；
2008-2016年 上海交通大学 副研究员；
2016-2017年 美国加州大学伯克利分校伯克利传感器与执行器中心(BSAC)博士后；
2017- 至今 上海交通大学电子信息与电气工程学院微纳电子学系 副研究员

已主持/参加了国家工信部民机重大专项（高温MEMS器件）、国家重大专项（极大规模集成电路制造技术及成套工艺，02专项）、国家973计划、国家863计划、国家自然科学基金、上海市科委、中国博士后基金等十几个项目。科研成果先后获上海市技术发明奖一等奖和上海市自然科学奖一等奖。已发表 SCI 论文五十余篇，发表的论文受到同行广泛引用，2014-2017年连续4年入选中国高被引学者榜单，授权专利十余项。多次受邀为 Journal of Micromechanics and Microengineering, Microelectronic engineering, Transactions on Semiconductor Manufacturing，Journal of Micro/Nanolithography, MEMS, and MOEMS等期刊审稿。

研究方向：

1、 高温MEMS工艺与器件；

2、 三维高密度封装；

3、 非硅微纳加工技术及器件；

4、 表面／界面失效机理研究。

主要论文：

[1]Ping Cheng, Hong Wang, Guifu Ding. Recent progress in through silicon vias (TSVs): Cu filling, microstructure characterization and mechanical properties. IEEE CPMT Symposium, Kyoto University, 2013, Japan, Invited talk

[2]Ping Cheng, Ying Zhang, Shenping Mao, Hong Wang, Guifu Ding*, Congchun Zhang, Xuhan Dai, Xiaolin Zhao. Novel electro-thermal latching micro-switch based on Ni/electrophoretic polymer micro-cantilevers. Journal of Micromechanics and Microengineering. 2014, 24(12 ): 125015 (9pp)
[3]Jie Han, Ping Cheng*, Hong Wang, Congchun Zhang, Jiubin Zhang, YanWang, Li Duan, Guifu Ding. MEMS-based Pt film temperature sensor on an alumina substrate. Materials Letters. 2014, 125:224–226
[5]Yazhou Zhang, Guifu Ding, Hong Wang, Ping Cheng*. Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs). Journal of Micromechanics and Microengineering. 2015, 25(4):045009 (11pp)
[6]Yazhou Zhang, Guifu Ding, Hong Wang, and Ping Cheng*. Effect of External Factors on Copper Filling in 3D Integrated. Journal of the Electrochemical Society. 2015, 162 (9) D427-D434
[7]Yazhou Zhang, Yunna Sun, Guifu Ding, Yan Wang, Hong Wang, and Ping Cheng*. Numerical Simulation and Mechanism Analysis of Through-Silicon Via (TSV) Filling Using an Arbitrary Lagrange-Eulerian (ALE) Method. Journal of the Electrochemical Society. 2015,162 (10) :D540-D549
[8]Zhaoyu Wang, Hong Wang, Ping Cheng*, Guifu Ding, Xiaolin Zhao. Simultaneous filling of through silicon vias（TSV）with different aspect ratios using multi-step direct current density. Journal of Micromechanics and Microengineering. 2014, 24(8 ): 085013(8pp)
[9]Gu Ting, Cheng Ping*, Wang Huiying，Dai Xuhan，Wang Hong，Ding Guifu. Micro-Compression Testing of TSV Copper Pillar: An in-situ Method and Mechanical Property. Electronic Materials Letters, 2014, 10 ( 4): 851-855
[10]Zhang Yazhou, Ding Guifu, Wang Hong, Cheng Ping*, Luo Jiangbo. Effect of Seed Layer Thickness Distribution on 3D Integrated Through-Silicon-Vias (TSVs) Filling Model. ECS Electrochemistry Letters. 2015, 4(6): D18-D20
[11]Zhang Yazhou, Ding Guifu, Cheng Ping, Wang Hong. Numerical Simulation and Experimental Verification of Additive Distribution in Through-Silicon Via during Copper Filling Process. Journal of the Electrochemical Society. 2015, 162(1): D62-D67
[14]Ming Wang, Ping Cheng, Jianhua Li, Yan Wang, Hong Wang, Guifu Ding and Xiaolin Zhao. Fabrication and performances of a novel copper-ordered-reinforced polymer composite interpose. Journal of Micromechanics and Microengineering. 24 (2014) 025016 (8pp)
[15]Huiying Wang, Ping Cheng, Su Wang, Hong Wang, Ting Gu, Junyi Li, Xiao Gu, Guifu Ding*. Effect of thermal treatment on the mechanical properties of Cu specimen fabricated using electrodeposition bath for through-silicon-via filling. Microelectronic Engineering. 2014, 114: 85–90

本科生课程：集成电路及微系统封装技术

研究生课程：集成电路封装技术；微电子可靠性与成品率