汪红

辽宁沈阳人，1982年毕业于东北大学化学系，1998年硕士毕业于日本九州工业大学，2003年进入上海交通大学微纳科学技术研究院，一直从事微纳结构功能材料的电化学制备、微尺度材料性能表征及其电化学微制造理论研究工作，在高深宽比微制造关键技术、TSV镀铜超填充机制以及微结构材料机械性能原位表征等方面有较深入的研究。先后主持完成国家863项目、自然科学基金、上海市发展基金、纳米专项等多项课题。在国内外学术刊物上发表学术论文60余篇，获国家授权专利9项，获上海市技术发明一等奖1项，省级发明创造三等奖1项。

研究方向：

1. 微细加工技术
2. 微纳结构功能材料制造及理论研究
3. 微尺度结构材料机械性能表征分析

主要论文：

1. JingWu, HongWang＊, Xiang Chen, Ping Cheng, Guifu Ding, Xiaolin Zhao, Yi Huang，Study of a novel cathode tool structure for improving heat removalin electrochemical micro-machining ，ElectrochimicaActa， 2012 ，75（7）：94–100
2. Li Guang-yang , Li Xue-ping , HongWang＊， Yang Zhuo-qing , Yao Jin-yuan , Ding Gui-fu，Fabrication and characterization of superhydrophobicsurfaceby electroplating regular rough micro-structures of metal nickel，Microelectronic Engineering，2012,95（7）：130-134
3. Hong Wang＊, RuiLiu,WeiQiao Jiang, Jun Zhu, JianZhiFeng, Gui Fu Ding, Xiaolin Zhao. A novel method for improving the adhesion strength of the electrodeposited Ni films in MEMS. Applied surface science. 2011, 257：2203-2207(SCI 源)
4. Hong Wang＊, Jun Tang, Guangyang Li, Congchun Zhang, Jun Zhu, ZhiminWang, GuiFu Ding and Xiaolin Zhao. A study on utilizing a chloride bath to electroform MEMS devices with high aspect  ratio structures. Journal of Micromechanics and Microengineering . 2010.20:115024(9pp)
5. Hong Wang＊, Rui Liu, FengJi Cheng, Ying Cao, GuiFu Ding, XiaoLin Zhao，Electrodepositing amorphous Ni-W alloys for MEMS. Microelectronic Engineering,2010, 87(10): 1901–1906
6. Jun Tang, Hong Wang＊,XinQiuGuo, Rui Liu, XuHanDai,Guifu Ding and ChunSheng Yang.An investigation of microstructure and mechanical properties of UV-LIGA nickel thin films electroplated in different electrolytes. Journal of micromechanical and microengineerin.2010.20: 025033 (9pp)
7. Jun Tang , Hong Wang＊ ,Rui Liu ,XuepingLi,Zhenjie Zhang ,JinyuanYao,Guifu Ding. A directly strain measuring method for electroplated nickel micro-tensile test.Microsyst Technol.2010,16（11）:1839–1844
8. Jun Tang, Hong Wang＊, Shichen Li, Rui Liu, ShengpingMao,Xueping Li, Congchun Zhang and Guifu Ding. Design and fabrication of a micron scale free-standing specimen for uniaxial Micro- tensile tests. Journal of Micromechanics and Microengineering.2009.19 :105015 (9pp)
9. Rui  Liu, Hong Wang＊ , Xueping Li, Jun Tang, Shengping Mao and Guifu Ding.Analysis, simulation and fabrication of MEMS springs for a micro-tensile system. Journal of Micromechanics and Microengineering. 2009. 19 :015027 (10pp)
10. R. Liu, H. Wang＊, X.-P. Li and G.-F. Ding.Study of internal stress of amorphous Ni–W alloy films.Materials Science and Technology. 2009,25（8）: 960-968