孙云娜-系主页

　　孙云娜，女，2017年博士毕业于上海交通大学 电子信息与电气工程学院 微纳电子学系，博士毕业之后在 上海交通 电子信息与电气工程学院 计算机系从事两年博士后研究，2019年加入 上海交通大学 电子信息与电气工程学院 微纳电子学系。

　　目前主要从事微流体散热、TSV封装系统的热机械可靠性、天线封装方向的研究。先后主持中国博士后基金(一等)、企业项目各一项，先后参与了国家973项目、国家预研项目、教育部高校创新成果项目、国家前沿探索课题等项目数项。发表论文21篇，其中第一作者论文10篇，并多次做大会口头报告和邀请报告，授权中国发明专利6项，担任多个SCI期刊审稿人。

研究方向：

1. TSV封装的热机械可靠性/封装系统的热管理技术

2. 微流体散热技术

3. 微纳多元兼容集成制造技术(MECMPs)

部分论文：

1. Jiangbo Luo, Guilian Wang, Yunna Sun*, Xiaolin Zhao and Guifu Ding*. (2018) Fabrication and characterization of a low-cost interposer with an intact insulation layer and ultra-low TSV leakage current, Journal of Micromechanics and Microengineering, 28.

2. Yunna Sun, Shi Sun, Yazhou Zhang, Jiangbo Luo, Yan Wang^⁎, Guifu Ding^⁎ and Yufeng Jin. (2016) Initial thermal stress and strain effects on thermal mechanical stability of through silicon via, Microelectronic Engineering 16.C: 11–19.

3. Yongpeng Wu, Yunna Sun, Jiangbo Luo, Ping Cheng, Yan Wang, Hong Wang and Guifu Ding*. (2019) Microstructure of Cu-diamond composites with near-perfect interfaces prepared via electroplating and its thermal properties. Materials Characterization, 150, 199-206.

4. Liyan Lai, Yunna Sun, Hao Wu, Zhuoqing Yang and Guifu Ding*. (2019) Enhanced adhesive strength between SU-8 photoresist and titanium substrate by an improved anodic oxidation method for high aspect-ratio microstructures. Journal of Micromechanics and Microengineering, 29.

5. Yunna Sun, Zhiyu Jin, Jiangbo Luo, Li Jian, Sun Yating, Wang Yan and Guifu Ding. (2017) Modeling and fabrication of the Redistribution Layer on the 2.5D Si interposer. IEEE, International Conference on Electronic Packaging Technology. (Best Student Paper Award 1st Place).

6. Yunna Sun, Jiangbo Luo, Zhuoqing Yang, Yan Wang and Guifu Ding. (2018) Development of a Polyimide/SiC-whisker/nano-particles composite with high thermal conductivity and low coefficient of thermal. IEEE, Electronic Components and Technology Conference. (Oral).

7. Yunna Sun, Yunting Sun, Jiangbo Luo, Huiying Wang, Zhuoqing Yang, Yan Wang, Guifu Ding and Kwangwoo Han. (2019) Enhancing Efficiency of Antenna-in-Package (AiP) by Through-Silicon-Interposer (TSI) with Embedded Air Cavity and Polyimide Dielectric Micro-Substrate. IEEE, Electronic Components and Technology Conference. (Oral).