题目1：Package Level Reliability and Qualification Introduction – By Daniel Zhu
1. Moisture Sensitivity Testing and Pre conditioning
2. Early Failure Rate and High Temperature Operating Life
3. Highly Accelerated Stress Test and Temperature Humidity Bias
4. Temperature Cycle and Thermal Shock
5. Power Temperature Cycle
6. High Temperature Storage Life
7. ESD and Latch up
This topic will give a brief introduction of package level reliability and qualification, it shows the relationship between product quality and reliability test, why do we need to do these reliability test and how do we do these reliability test.
Daniel Zhu is test engineer in Boost Converter & Controller Solutions in TI, where for the past 6 years he has developed test solutions for many buck-boost converter devices. Prior to joining TI Daniel worked in ASESH, NXP and Accent. Daniel has a Master degree in electrical engineering from Nanjing University of Aeronautics and Astronautics.
题目2：Bench automation and device failure investigation introduction – By Jovi He
Ø IC development introduction
• New product development flow
• Product validation
Ø Bench validation
• Bench validation and automation
• Case study
Ø Device failure investigation
• Why IC fails
• Device failure analysis flow
• Case study
This topic will present the briefs of IC new product development flow and how to validate a product before releasing to market, then give the introduction for the bench validation/characterization and the device issue analysis, include the flow and related case studies.
Jovi He is a device failure investigation engineer in TI MSP430. Jovi joined TI in 2012 as a bench validation/characterization engineer, then started working on device failure investigation since 2018. Before joining TI, Jovi worked in Freescale Semiconductor (Now NXP) as a test engineer for 3 years. Jovi received a Master in EE from Tianjin Polytechnic University.